Apparatus and method for fast evaluation of electroplating formulation performance in microvia filling

摘要

The presently claimed invention provides an electrochemical analytical apparatus and a method for evaluating performance of electroplating formulations of electrolyte solutions used for via filling. The electrochemical analytical apparatus comprises an electric power generating device, an electrical output signal measurement device, an electrochemical measurement device, and a motion generator. The electrochemical measurement device of the present invention comprises a supporting structure, a cavity, a cavity electrode, and a surface electrode. The electrical output signals of the cavity electrode and the surface electrode are measured during electroplating for calculating a filling performance value. The presently claimed invention provides an accurate, fast and cost effective method for evaluating performance of electroplating formulations, following with choosing the electroplating formulation of the highest FP value for actual microvia filling process.

主权项

1. An electrochemical measurement device for evaluating performance of an electroplating formulation of an electrolyte solution used for via filling, comprising:
at least one supporting structure, comprising at least one measurement surface for contacting the electrolyte solution; at least one cavity, located at the supporting structure, and comprising a top cavity opening and a bottom cavity opening, wherein the top cavity opening is located on the measurement surface of the supporting structure, and allows the electrolyte solution to flow into the cavity; at least one cavity electrode, wherein the cavity electrode comprises at least one cavity electrolytic surface, which is in contact with the bottom cavity opening, and is used for being electroplated by the electrolyte solution; and at least one surface electrode, wherein the surface electrode comprises at least one top electrolytic surface, which is located on the measurement surface of the supporting structure, and is used for being electroplated by the electrolyte solution; and wherein the surface electrode is electrically isolated from the cavity electrode by the supporting structure.