Method of assembling a heat dissipating module of an electronic device

摘要

A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

主权项

1. A method of assembling a heat dissipating module of an electronic device, the method comprising steps of:
(a) providing at least one lateral plate of a casing, at least one heat generation element, a circuit board and a fastening assembly; (b) firmly fixing the at least one heat generation element on the at least one lateral plate through a fixing element; (c) combining the at least one lateral plate and the circuit board together through the fastening assembly, wherein a plurality of pins of the at least one heat generation element are inserted into corresponding holes of the circuit board, so that the at least one heat generation element is electrically connected with a trace of the circuit board; (d) allowing the at least one lateral plate and the circuit board to pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board; and (e) fixing a lower plate on a lower portion of the at least one lateral plate.