发明名称 Reflective mask blank for EUV lithography, substrate with funtion film for the mask blank, and methods for their production
摘要 A substrate with a conductive film to be used for producing a reflective mask blank for EUV lithography, comprising a substrate and a conductive film formed on the substrate, wherein the conductive film has at least two layers of a lower layer formed on the substrate side and an upper layer formed on the lower layer; the lower layer is a CrN type film which contains Cr and N; the upper layer is a CrON type film which contains Cr, N and O; in the CrN type film, the total content of Cr and N is at least 85 at %, and the compositional atomic ratio of Cr to N is Cr:N=9.5:0.5 to 3:7; in the CrON type film, the total content of Cr, N and O is at least 85 at %, and the compositional atomic ratio of Cr to (N+O) is Cr:(N+O)=9.5:0.5 to 3:7; and the film thickness of the CrON type film is from 0.5 to 3 nm, and the standard deviation of the film thickness distribution of the CrON type film is at most 0.18 nm.
申请公布号 US9618836(B2) 申请公布日期 2017.04.11
申请号 US201514678109 申请日期 2015.04.03
申请人 Asahi Glass Company, Limited 发明人 Kageyama Junichi;Hayashi Kazuyuki
分类号 G03F1/24;C23C14/35;C23C14/06;C23C14/58;G03F1/38 主分类号 G03F1/24
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A substrate with a conductive film to be used for producing a reflective mask blank for EUV lithography, comprising a substrate and a conductive film formed on the substrate; wherein the conductive film has at least two layers of a layer (lower layer) formed over the substrate side and a layer (upper layer) formed on the lower layer; the lower layer of the conductive film is a CrN type film which contains chromium (Cr) and nitrogen (N); the upper layer of the conductive film is a CrON type film which contains Cr, N and oxygen (O); in the CrN type film, the total content of Cr and N is at least 85 at %, and the compositional ratio (atomic ratio) of Cr to N is Cr:N=9.5:0.5 to 3:7; in the CrON type film, the total content of Cr, N and O is at least 85 at %, and the compositional ratio (atomic ratio) of Cr to (N+O) is Cr:(N+O)=9.5:0.5 to 3:7; and the film thickness of the CrON type film is from 0.5 to 3 nm, and the standard deviation of the film thickness distribution of the CrON type film is at most 0.18 nm.
地址 Chiyoda-ku JP