Integrated circuits on a wafer and methods for manufacturing integrated circuits

摘要

Integrated circuits (1) on a wafer comprise a wafer substrate (2) and a plurality of integrated circuits (Ia, Ib, Ic) formed on the wafer substrate (2). Each integrated circuit (Ia, Ib, Ic) comprises an electric circuit (24) and some of the integrated circuits (Ib, Ic) comprise, in addition to their electric circuits (24), process control modules (3) as integral parts. The process control modules (3) are employed during dicing and pick-and-place to align the dicing/pick-and-place devices.

主权项

1. An apparatus comprising
a wafer substrate; and a plurality of integrated circuits formed on the wafer substrate and separated from one another by saw lines in the wafer and configured and arranged for separating the respective integrated circuits, each integrated circuit having an electric circuit and a first seal ring surrounding the electric circuit, and wherein at least a plurality but not all of the integrated circuits include
a process control module, configured and arranged to process characteristics of the apparatus, as an integral part of the integrated circuit and a second seal ring surrounding the process control module, andan optical process control module as integral parts,wherein the optical process control module in at least one of the plurality of the integrated circuits is surrounded by the first seal ring and not the second seal ring and, in another of the plurality of the integrated circuits, the optical process control module is surrounded by the second seal ring and not the first seal ring.