| 发明名称 |
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS |
| 摘要 |
An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface;a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity;a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface. |
| 申请公布号 |
US2017098631(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201615275752 |
申请日期 |
2016.09.26 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
Kikuchi Ryo;IMAIZUMI Nobuhiro;Onuki Hiroshi |
| 分类号 |
H01L25/065;H01L23/00;H01L25/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component comprising:
a substrate configured to
include a first portion that first thermal conductivity, andhave a first surface and a second surface opposite to the first surface; a second portion configured to
be formed inside the first portion, andhave second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface. |
| 地址 |
Kawasaki-shi JP |
