SOFT POST PACKAGE REPAIR OF MEMORY DEVICES

摘要

Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

主权项

1. A method of operating a memory device that has been packaged and includes a memory array and a first storage element, the method comprising:
entering the memory device into a post package repair mode; and issuing to the memory device a first activate command with first address data while the memory device is in the post package repair mode, wherein the first activate command causes the memory device to store the first address data in the first storage element as first defective address data and to be free from accessing the memory array responsive to the first address data, and wherein the first defective address data corresponds to a data address of the memory array to be accessed that includes at least one defective memory cell.