| 摘要 |
An optoelectronic semiconductor device (9) is specified, comprising – a light emitting diode component (1) having at least one light emitting diode chip (11) and a cover surface (1a) disposed downstream of the light emitting diode chip (11) in an emission direction (Z), – a conversion element (2) disposed downstream of the light emitting diode component (1) in the emission direction (Z), – a frame body (3) and – a cover body (4) formed from a radiation-transmissive material, wherein – the frame body (3) encloses all side surfaces (2c) of the conversion element (2) in a frame-like manner, – the cover body (4) is disposed downstream of the conversion element (2) in the emission direction (Z) and covers the conversion element (2) at the cover surface (2a) thereof facing away from the light emitting diode chip (11). |
