| 发明名称 |
MEMS DIE WITH SENSING STRUCTURES |
| 摘要 |
A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension. |
| 申请公布号 |
US2017097314(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201615286407 |
申请日期 |
2016.10.05 |
| 申请人 |
Carrier Corporation |
发明人 |
Christenson John Carl;Potasek David P.;Childress Marcus Allen |
| 分类号 |
G01N27/14;G01N33/00;B81B7/02 |
主分类号 |
G01N27/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectromechanical systems die comprising:
a thermally conductive substrate including an outer surface; and a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension. |
| 地址 |
Palm Beach Gardens FL US |
