发明名称 |
METHOD OF MODIFYING EPITAXIAL GROWTH SHAPE ON SOURCE DRAIN AREA OF TRANSISTOR |
摘要 |
Methods for forming semiconductor devices, such as FinFETs, are provided. An epitaxial film is formed over a semiconductor fin, and the epitaxial film includes a top surface having two facets. A cap layer is deposited on the top surface, and portions of the epitaxial film in a lateral direction are removed. Having a smaller lateral dimension prevents the epitaxial film from merging with an adjacent epitaxial film and creates a gap between the epitaxial film and the adjacent epitaxial film. |
申请公布号 |
US2017098547(A1) |
申请公布日期 |
2017.04.06 |
申请号 |
US201615384051 |
申请日期 |
2016.12.19 |
申请人 |
Applied Materials, Inc. |
发明人 |
KIM Yihwan;LI Xuebin;DUBE Abhishek |
分类号 |
H01L21/308;H01L29/66;H01L21/02 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a semiconductor device, comprising:
forming an epitaxial film over a semiconductor fin, wherein the epitaxial film includes a top surface, a first corner, and a second corner opposite the first corner; depositing a cap layer non-conformally on the top surface; and removing the first and second corners of the epitaxial film. |
地址 |
Santa Clara CA US |