发明名称 METHOD OF MODIFYING EPITAXIAL GROWTH SHAPE ON SOURCE DRAIN AREA OF TRANSISTOR
摘要 Methods for forming semiconductor devices, such as FinFETs, are provided. An epitaxial film is formed over a semiconductor fin, and the epitaxial film includes a top surface having two facets. A cap layer is deposited on the top surface, and portions of the epitaxial film in a lateral direction are removed. Having a smaller lateral dimension prevents the epitaxial film from merging with an adjacent epitaxial film and creates a gap between the epitaxial film and the adjacent epitaxial film.
申请公布号 US2017098547(A1) 申请公布日期 2017.04.06
申请号 US201615384051 申请日期 2016.12.19
申请人 Applied Materials, Inc. 发明人 KIM Yihwan;LI Xuebin;DUBE Abhishek
分类号 H01L21/308;H01L29/66;H01L21/02 主分类号 H01L21/308
代理机构 代理人
主权项 1. A method for forming a semiconductor device, comprising: forming an epitaxial film over a semiconductor fin, wherein the epitaxial film includes a top surface, a first corner, and a second corner opposite the first corner; depositing a cap layer non-conformally on the top surface; and removing the first and second corners of the epitaxial film.
地址 Santa Clara CA US