| 发明名称 |
Integrated Flip Chip Device Array |
| 摘要 |
An optoelectronic device module with improved light emission of approximately 4π steradians is provided. In one embodiment, the optoelectronic device module includes a first and a second set of optoelectronic devices. Each optoelectronic device includes a first contact and a second contact. A contact element including a first lateral side and a second lateral side connects the optoelectronic devices. The first contact of each optoelectronic device in the first set of optoelectronic devices is connected to the first lateral side of the contact element and the first contact of each optoelectronic device in the second set of optoelectronic devices is connected to the second lateral side of the contact element. |
| 申请公布号 |
US2017095582(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201615283490 |
申请日期 |
2016.10.03 |
| 申请人 |
Sensor Electronic Technology, Inc. |
发明人 |
Shur Michael;Shatalov Maxim S.;Dobrinsky Alexander;Lakios Emmanuel |
| 分类号 |
A61L2/08;H01L27/15;A61L2/10;H01L27/12 |
主分类号 |
A61L2/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optoelectronic device module, comprising:
a first and a second set of optoelectronic devices, wherein each optoelectronic device includes a first contact and a second contact; and a contact element including a first lateral side and a second lateral side, wherein the first contact of each optoelectronic device in the first set of optoelectronic devices is connected to the first lateral side of the contact element and the first contact of each optoelectronic device in the second set of optoelectronic devices is connected to the second lateral side of the contact element. |
| 地址 |
Columbia SC US |
