METHOD OF FORMING HOLE IN GLASS SUBSTRATE BY USING PULSED LASER, AND METHOD OF PRODUCING GLASS SUBSTRATE PROVIDED WITH HOLE

摘要

Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

主权项

1. A method of forming a hole in a glass substrate by using a pulsed laser, the method comprising:
(1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens, wherein the concave portion on the first surface has a diameter φ and a depth d, wherein the diameter φ is greater than or equal to a diameter S (φ≧S) of a spot on the first surface formed by the pulsed laser, the diameter S being expressed by a formula (i),
the spot diameter S=(4×λ×f×M2)/(π×r)  (i), where λ is a wavelength of the pulsed laser, f is a focal length of the lens, M2 is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and wherein the depth d is greater than or equal to 0.7 times the diameter φ; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.