发明名称 |
3D FORMED LDS LINER AND METHOD OF MANUFACTURING LINER |
摘要 |
A method of manufacturing a 3D LDS liner includes providing an LDS sheet, forming 3D contoured liners in the LDS sheet, laser structuring circuit patterns on the 3D contoured liners to provide a laser structured circuit pattern, selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners, and removing the 3D contoured liners from the LDS sheet. A formed LDS liner includes a thin LDS film having a 3D contoured surface vacuum formed from an LDS sheet. The LDS film includes an inner surface and an outer surface. A laser structured circuit pattern is etched into the LDS film, and a conductive layer is selectively plated on the laser structured circuit pattern forming a circuit on the LDS film. The circuit may have a non-planar region. |
申请公布号 |
US2017095889(A1) |
申请公布日期 |
2017.04.06 |
申请号 |
US201514873821 |
申请日期 |
2015.10.02 |
申请人 |
TYCO ELECTRONICS CORPORATION ;Tyco Electronics AMP Korea Co., Ltd. |
发明人 |
Bishop Bruce;Kim Jung Hoon;Park June Gun |
分类号 |
B23K26/351;B23K26/34;B23K26/00 |
主分类号 |
B23K26/351 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a 3D LDS liner, the method comprising:
providing an LDS sheet; forming 3D contoured liners in the LDS sheet; laser structuring circuit patterns on the 3D contoured liners to provide laser structured circuit patterns; selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners; and removing the 3D contoured liners from the LDS sheet. |
地址 |
Berwyn PA US |