发明名称 3D FORMED LDS LINER AND METHOD OF MANUFACTURING LINER
摘要 A method of manufacturing a 3D LDS liner includes providing an LDS sheet, forming 3D contoured liners in the LDS sheet, laser structuring circuit patterns on the 3D contoured liners to provide a laser structured circuit pattern, selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners, and removing the 3D contoured liners from the LDS sheet. A formed LDS liner includes a thin LDS film having a 3D contoured surface vacuum formed from an LDS sheet. The LDS film includes an inner surface and an outer surface. A laser structured circuit pattern is etched into the LDS film, and a conductive layer is selectively plated on the laser structured circuit pattern forming a circuit on the LDS film. The circuit may have a non-planar region.
申请公布号 US2017095889(A1) 申请公布日期 2017.04.06
申请号 US201514873821 申请日期 2015.10.02
申请人 TYCO ELECTRONICS CORPORATION ;Tyco Electronics AMP Korea Co., Ltd. 发明人 Bishop Bruce;Kim Jung Hoon;Park June Gun
分类号 B23K26/351;B23K26/34;B23K26/00 主分类号 B23K26/351
代理机构 代理人
主权项 1. A method of manufacturing a 3D LDS liner, the method comprising: providing an LDS sheet; forming 3D contoured liners in the LDS sheet; laser structuring circuit patterns on the 3D contoured liners to provide laser structured circuit patterns; selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners; and removing the 3D contoured liners from the LDS sheet.
地址 Berwyn PA US