INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

摘要

An integrated device that includes a printed circuit board (PCB) and a package on package (PoP) device coupled to the printed circuit board (PCB). The package on package (PoP) device includes a first package that includes a first electronic package component (e.g., first die) and a second package coupled to the first package. The integrated device includes a first encapsulation layer formed between the first package and the second package. The integrated device includes a second encapsulation layer that at least partially encapsulates the package on package (PoP) device. The integrated device is configured to provide cellular functionality, wireless fidelity functionality and Bluetooth functionality. In some implementations, the first encapsulation layer is separate from the second encapsulation layer. In some implementations, the second encapsulation layer includes the first encapsulation layer. The package on package (PoP) device includes a gap controller located between the first package and the second package.

主权项

1. An integrated device comprising:
a printed circuit board (PCB); a package on package (PoP) device coupled to the printed circuit board (PCB), wherein the package on package (PoP) device comprises:
a first package comprising a first electronic package component; anda second package coupled to the first package; a first encapsulation layer formed between the first package and the second package; and a second encapsulation layer that at least partially encapsulates the package on package (PoP) device, wherein the integrated device is configured to provide cellular functionality, wireless fidelity (WiFi) functionality and Bluetooth functionality.