| 发明名称 |
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE |
| 摘要 |
A method of fabricating a semiconductor package is disclosed. The method includes forming a plurality of semiconductor chips and a mold layer covering the semiconductor chips on a substrate, forming outer terminals on a bottom surface of the substrate, coating a water-soluble material on the bottom surface of the substrate and the outer terminals to form a coating layer, cutting the substrate and the mold layer to separate the semiconductor chips from each other, and forming a shielding layer on the cutted mold layer. |
| 申请公布号 |
US2017098578(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201615158890 |
申请日期 |
2016.05.19 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JANGWOO;JUNG YOUNGDOO |
| 分类号 |
H01L21/78;H01L23/00;H01L21/02 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a semiconductor package, comprising:
forming a plurality of semiconductor chips and a mold layer covering the semiconductor chips, on a substrate; forming outer terminals on a bottom surface of the substrate; coating a water-soluble material on the bottom surface of the substrate and the outer terminals to form a coating layer; cutting the substrate and the mold layer to separate the plurality of semiconductor chips from each other; and forming a shielding layer on the culled mold layer. |
| 地址 |
SUWON-SI KR |
