发明名称 UV LED SYSTEMS AND METHODS
摘要 Ultra violet light-emitting diode (hereafter UV LED) curing units containing one or X array or XY arrays of UV LED modules with integrated optical, mechanical, and heat dissipation systems, and one, or X array, or XY arrays of extrusions with integrated air or liquid cooling systems to receive and house the integrated UV LED. The UV LED modules may be any size or shape depending on the power requirements of a given curing application. The LED chips or the groups of LED chips used for the above UV LED modules may be in other wavelengths for other applications. The UV LED modules have excellent heat dissipation because the LED chips or groups of LED chips are directly mounted on metal extrusion. The LED modules also have a single optical lens system between the LED chips and the surrounding ambient air.
申请公布号 US2017097150(A1) 申请公布日期 2017.04.06
申请号 US201615281303 申请日期 2016.09.30
申请人 Sunlite Science & Technology, Inc. 发明人 Chen Jeff;Suo Xiaofang
分类号 F21V29/57;F21V7/00;F21V29/67;F26B3/28;F21V5/04;F21V13/04;F21V25/10;F21V29/89;F21V23/06;F21V29/70 主分类号 F21V29/57
代理机构 代理人
主权项 1. A curing unit comprising: a housing including a cross member; an LED module mounted on a first side of the cross member, and a substantially cylindrical heat-dissipating sleeve mounted an opposite side of the cross member, the module being fastenable to the heat-dissipating member through an aperture created in the cross member; and an electrical connection to the module made via electrical conduits which extend through the sleeve to power an LED chip on the module.
地址 Lawrence KS US