CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

摘要

This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, wherein the first top surface has a first insulating layer formed thereon, and the sensing chip comprises a sensing device adjacent to the first top surface and a plurality of conductive pads formed within the first insulating and adjacent to the sensing device, and a wiring layer formed on the first bottom surface to respectively connect to each of the conductive pads; and a dam formed on the first insulating layer adjacent to the sensing device.

主权项

1. A chip scale sensing chip package, comprising:
a sensing chip, comprising:
a sensing device substrate having a first top surface and a first bottom surface opposite to each other;a first insulating layer formed on the first top surface;a sensing device formed within the sensing device substrate and adjacent to the first top surface; anda plurality of conductive pads formed within the sensing device substrate and adjacent to the sensing device; a wiring layer formed on the first bottom surface and connected to each of the conductive pads; and a dam, formed on the first insulating layer adjacent to the sensing device.