| 摘要 |
The present disclosure provides a method of manufacturing a three dimensional memory device to suppress warpage of conductive patterns. The method may include providing a multilayered structure in which different material layers are alternately stacked over a substrate, etching partially the material layers to form a multi-step structure, each step being formed of at least one pair of the material layers, forming vertical support layers, each support layer being disposed on a top face of each step, removing partially the material layers to form recesses, filling the recesses with a conductive material to form gate lines, the gate line defining an upper portion of the step, and forming vertical contact plugs respectively on the upper portion of the step. |
