CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

A module board includes insulating layers, ground electrodes, signal electrodes, and interlayer vias. Electronic components are mounted on a front surface of the module board, and a sealing resin layer covers the electronic components. A half-cut portion is provided in the module board at an outer peripheral edge thereof and recessed to an intermediate position in a thickness direction of the module board. A shield layer cover the sealing resin layer. The shield layer includes a frame portion that extends into the half-cut portion. The frame portion is electrically connected to ground interlayer vias that are exposed at an end surface and a bottom surface of the half-cut portion.

主权项

1. A circuit module comprising:
a module board on which an electronic component is mounted at a front-surface side; an interlayer via provided at a position shifted from an outer peripheral edge of the module board toward a central region of the module board, the interlayer via having a ground potential; an insulating sealing resin layer provided on a front surface of the module board so that the electronic component is embedded in the sealing resin layer; a half-cut portion located at the outer peripheral edge of the module board and recessed from the front surface of the module board to an intermediate position in a thickness direction of the module board so that a portion of the interlayer via is exposed in the half-cut portion; and a conductive shield layer provided at the front surface of the module board to cover the sealing resin layer, the conductive shield layer including a portion that extends into the half-cut portion and that is electrically connected to the interlayer via.