| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device is provided. The semiconductor device can be manufactured with a reduced cost. The semiconductor device (1D) includes, a substrate (100D), which includes a main surface (101D) and a recess (108D) depressed from the main surface (101D), and includes a semiconductor material; a wiring layer (200D) in which at least a portion thereof is formed on the substrate (100D); one or more first elements (370D) accommodated in the recess (108D); a sealing resin (400D) covering at least a portion of the one or more first elements (370D) and filled in the recess (108D); and a plurality of columnar conductive portions (230D) penetrating through the sealing resin (400D) in the depth direction of the recess (108D), and respectively connected with the portion of the wiring layer (200D) that is formed at the recess (108D). |
| 申请公布号 |
US2017098625(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201615379437 |
申请日期 |
2016.12.14 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
TAKEDA Hirofumi;TAKADA Yoshihisa |
| 分类号 |
H01L25/065;H01L23/13;H01L23/00;H01L23/31;H01L23/498;H01L25/00;H01L23/14 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a substrate, including a main surface and a recess depressed from the main surface, and comprising a semiconductor material; a wiring layer, at least a portion of the wiring layer formed on the substrate; one or more elements, accommodated in the recess; a sealing resin, configured to cover at least a portion of the one or more elements; and
a resin forming portion, formed on at least one of the main surface and the recess. |
| 地址 |
Kyoto JP |
