METHOD AND APPARATUS FOR REDUCING IN-PROCESS AND IN-USE STICTION FOR MEMS DEVICES

摘要

The present disclosure involves forming a method of fabricating a Micro-Electro-Mechanical System (MEMS) device. A plurality of openings is formed in a first side of a first substrate. A dielectric layer is formed over the first side of the substrate. A plurality of segments of the dielectric layer fills the openings. The first side of the first substrate is bonded to a second substrate that contains a cavity. The bonding is performed such that the segments of the dielectric layer are disposed over the cavity. A portion of the first substrate disposed over the cavity is transformed into a plurality of movable components of a MEMS device. The movable components are in physical contact with the dielectric the layer. Thereafter, a portion of the dielectric layer is removed without using liquid chemicals.

主权项

1. A method of fabricating a Micro-Electro-Mechanical System (MEMS) device, comprising:
forming a layer on a first side of a first substrate, wherein the layer includes a plurality of protruding segments that are embedded in the first substrate; bonding the first substrate to a second substrate that contains a cavity, wherein the layer is disposed between the first substrate and the second substrate and over the cavity after the bonding; and etching a second side of the first substrate to form a plurality of movable components of a MEMS device, the second side being opposite the first side, wherein the movable components of the MEMS device are attached to the layer.