| 发明名称 |
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD |
| 摘要 |
A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less. |
| 申请公布号 |
US2017099732(A1) |
申请公布日期 |
2017.04.06 |
| 申请号 |
US201515127203 |
申请日期 |
2015.03.26 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. ;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
发明人 |
KASUGA Takashi;OKA Yoshio;PARK Jinjoo;UEHARA Sumito;MIURA Kousuke;UEDA Hiroshi |
| 分类号 |
H05K1/09;H05K3/24;H05K3/12 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1: A substrate for a printed circuit board, comprising:
a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. |
| 地址 |
Osaka-shi, Osaka JP |
