| 主权项 |
1. An integrated circuit (IC) structure comprising:
an IC chip interconnect surface including a radially inner region positioned within a radially outer region; a first plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein each of the first plurality of conductive pillars includes a solder bump contacting a longitudinally distal end of the first conductive pillar, relative to the IC chip interconnect surface, wherein each of the first plurality of conductive pillars includes a laser-sintered metal, a second plurality of conductive pillars extending substantially non-perpendicularly from the interconnect surface of the IC chip, wherein each of the second plurality of conductive pillars is positioned radially outward from the first plurality of conductive pillars, relative to the radial centerline axis; and a third plurality of conductive pillars extending substantially non-perpendicularly from the interconnect surface of the IC chip, wherein each of the third plurality of conductive pillars is positioned radially outward from the second plurality of conductive pillars, wherein an angular orientation of the second plurality of conductive pillars relative to the radial centerline axis and the third plurality of conductive pillars relative to the radial centerline axis increases by an angular orientation difference for each successive plurality of the conductive pillars in a direction from the radially inner region toward the radially outer region, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon. |
