METHODS OF ERROR DETECTION IN FABRICATION PROCESSES

摘要

Methods and computer program products for performing automatically determining when to shut down a fabrication tool, such as a semiconductor wafer fabrication tool, are provided herein. The methods include, for example, creating a measurement vector including process parameters of semiconductor wafers, creating a correlation matrix of correlations between measurements of parameters obtained of each wafer, creating autocorrelation matrixes including correlations between measurements of the parameter obtained for pairs of wafers; creating a combined matrix of correlation and autocorrelation matrixes, obtaining a T2 value from the measurement vector and combined matrix, and stopping a semiconductor wafer fabrication tool if the T2 value exceeds a critical value.

主权项

1. A method for stopping semiconductor fabrication, comprising:
creating a measurement vector comprising a measurement of each of one or more parameters from each of one or more semiconductor wafers; for each of the one or more semiconductor wafers, creating a correlation matrix, wherein the correlation matrix comprises correlations between measurements of parameters obtained of each said wafer; for each pair of the one or more semiconductors for which a measurement of a parameter has been obtained from each semiconductor wafer of the pair, creating an autocorrelation matrix, wherein the autocorrelation matrix comprises correlations between measurements of the parameter obtained of each wafer of the pair; creating a combined matrix, wherein creating comprises combining correlation and autocorrelation matrixes into a combined matrix; obtaining a T2 value from the measurement vector and combined matrix; and stopping a semiconductor wafer fabrication tool if the T2 value exceeds a critical value.