发明名称 |
ENCAPSULATED DEVICE OF SEMICONDUCTOR MATERIAL WITH REDUCED SENSITIVITY TO THERMO-MECHANICAL STRESSES |
摘要 |
An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip. |
申请公布号 |
EP3151271(A1) |
申请公布日期 |
2017.04.05 |
申请号 |
EP20160161856 |
申请日期 |
2016.03.23 |
申请人 |
STMicroelectronics S.r.l. |
发明人 |
TOCCHIO, Alessandro;VALZASINA, Carlo;GUERINONI, Luca;ALLEGATO, Giorgio |
分类号 |
H01L23/13;B81B7/00;B81C1/00;G01L19/14;H01L21/56 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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