发明名称 |
HEATED CAPACITOR AND METHOD OF FORMING THE HEATED CAPACITOR |
摘要 |
A heated capacitor runs current through either a lower metal plate, an upper metal plate, a lower metal trace that lies adjacent to a lower metal plate, an upper metal trace that lies adjacent to an upper metal plate, or both a lower metal trace that lies adjacent to a lower metal plate and an upper metal trace that lies adjacent to an upper metal plate to generate heat from the resistance to remove moisture from a moisture-sensitive insulating layer. |
申请公布号 |
EP3149752(A1) |
申请公布日期 |
2017.04.05 |
申请号 |
EP20150799487 |
申请日期 |
2015.05.28 |
申请人 |
Texas Instruments Incorporated |
发明人 |
GUO, Honglin;WILLIAMS, Byron, Lovell |
分类号 |
H01G2/08;H01G4/258 |
主分类号 |
H01G2/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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