发明名称 HEATED CAPACITOR AND METHOD OF FORMING THE HEATED CAPACITOR
摘要 A heated capacitor runs current through either a lower metal plate, an upper metal plate, a lower metal trace that lies adjacent to a lower metal plate, an upper metal trace that lies adjacent to an upper metal plate, or both a lower metal trace that lies adjacent to a lower metal plate and an upper metal trace that lies adjacent to an upper metal plate to generate heat from the resistance to remove moisture from a moisture-sensitive insulating layer.
申请公布号 EP3149752(A1) 申请公布日期 2017.04.05
申请号 EP20150799487 申请日期 2015.05.28
申请人 Texas Instruments Incorporated 发明人 GUO, Honglin;WILLIAMS, Byron, Lovell
分类号 H01G2/08;H01G4/258 主分类号 H01G2/08
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