| 摘要 |
Provided is a light emitting device package (100). The light emitting device package comprises a first conductive type package body, comprising a cavity (103) in an upper portion thereof;
an insulating layer (120) on the package body;
a plurality of compound semiconductor layers comprising a conductive type buffer layer (151) contacting a bottom surface of the cavity (103) of the package body;
an electrode (156) on the plurality of compound semiconductor layers;
a first metal layer (140) electrically connected to the package body (110) and disposed on a part of the insulating layer (120); and
a second metal layer (145) electrically connected to the electrode (156) and disposed on an other part of the insulating layer (156). |
