发明名称 VOID FORMING COMPOSITION, SEMICONDUCTOR DEVICE PROVIDED WITH VOIDS FORMED USING COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING COMPOSITION
摘要 [Problem] To provide a composition for gap formation capable of forming sacrifice areas made of a sacrificial material decomposable completely into vapor at a desired temperature, and also to provide a semiconductor device-manufacturing method using the composition. [Solution] Disclosed is a composition for gap formation comprising a polymer and a solvent: wherein said polymer comprising five or more of repeating units which are represented by at least one kind of the following formula (1) or (2): [each of Ar 1 , Ar 2 and Ar 2' is independently a substituted or unsabstituted aromatic group; and each of L 1 and L 2 is independently oxygen, sulfur, alkyl, sulfone, amide, ketone or a group represented by the following formula (3): {Ar 3 is an aromatic group; and L 3 is a trivalent atom selected from the group consisting of nitrogen, boron and phosphorus}].
申请公布号 EP3150668(A1) 申请公布日期 2017.04.05
申请号 EP20150800354 申请日期 2015.05.26
申请人 AZ Electronic Materials (Luxembourg) S.à.r.l. 发明人 NAKASUGI Shigemasa;KINUTA Takafumi;NOYA Go
分类号 C08L65/00;C08G61/12;H01L21/312;H01L21/768;H01L23/532 主分类号 C08L65/00
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