| 摘要 |
A semiconductor package mounted with a semiconductor component comprising a package upper surface and a package lower surface, and a package front surface and a package back surface, facing each other respectively, wherein the package front surface and the package back surface are adjacent to the package upper surface and the package lower surface respectively, the package upper surface and the package lower surface are disposed so that the thickness of the package decreases from the package front side toward the package back surface side, and a protrusion is formed on at least either the package upper surface or the package lower surface so as to be continuous to the package back surface, wherein a recess step is formed by defining a recess approximately in the center of the package back surface, and a protrusion is formed protruding from the bottom surface of the recess step and the top of the protrusion is fit within the recess step. |
