发明名称 METHOD FOR SPLITTING BRITTLE SUBSTRATE
摘要 A cutter edge (51) is caused to slide to generate a plastic deformation on a first surface (SF1) of a brittle substrate (4), thus forming a trench line (TL). The trench line (TL) is formed so as to obtain a crack-free state in which the brittle substrate (4) seamlessly continues in a direction intersecting the trench line (TL) directly below the trench line (TL). The crack-free state is then maintained. A crack of the brittle substrate (4) in its thickness direction is extended along the trench line (TL) to form a crack line (CL). The brittle substrate (4) is divided along the crack line (CL).
申请公布号 EP3150561(A1) 申请公布日期 2017.04.05
申请号 EP20150799770 申请日期 2015.03.31
申请人 Mitsuboshi Diamond Industrial Co., Ltd. 发明人 SOYAMA Hiroshi
分类号 C03B33/037;B28D5/00 主分类号 C03B33/037
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