DOUBLE-SIDED HEAT EXCHANGER FOR FLUID-COOLED ELECTRONICS WITH A FLAT COPLANER SERIES-WISE COOLANT FLOW PATH

摘要

A fluid-cooled electronics assembly (10) for high-power electronics includes an arrangement (16) of electronic components that defines an upper-side (18) of the arrangement (16) and a lower-side (20) of the arrangement (16) opposite the upper-side (18). An upper-chamber (24) is thermally coupled to the upper-side (18), and a lower-chamber (30) thermally coupled to the lower-side (20). The upper-chamber (24) and the lower-chamber (30) are further configured to direct flowing-coolant (14) series-wise from the lower-chamber (30) into the upper-chamber (24). The upper-chamber (24) and the lower-chamber (30) are further configured to cooperatively define a manifold-connection (40) operable to couple the assembly (10) to a manifold-outlet (42) and a manifold-inlet (44) of a coolant-manifold (12). The assembly (10) also includes a fitting (46) configured to define an inlet-port (48) of the assembly (10) that directs the flowing-coolant (14) from the manifold-outlet (42) to the lower-inlet (32), and an outlet-port (50) that directs the flowing-coolant (14) from the upper-outlet (28) to the manifold-inlet (44). The inlet-port (48) and the outlet-port (50) are characterized as adjacent and side-by-side ports that are segregated from each other by a wall-section (54).