发明名称 |
METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER |
摘要 |
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer. |
申请公布号 |
EP3011810(A4) |
申请公布日期 |
2017.04.05 |
申请号 |
EP20140822699 |
申请日期 |
2014.06.23 |
申请人 |
Sanmina Corporation |
发明人 |
IKETANI, Shinichi;KERSTEN, Dale |
分类号 |
H05K3/10;H05K3/46 |
主分类号 |
H05K3/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|