SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL

摘要

A system and method for packaging a semiconductor device (20) that includes a wall to reduce electromagnetic coupling is presented. A semiconductor device has a substrate (74) on which a first circuit (22) and a second circuit (24) are formed proximate to each other. An isolation wall (50) of electrically conductive material is located between the first circuit and the second circuit, the isolation wall (50) being configured to reduce inductive coupling between the first and second circuits during an operation of the semiconductor device. The isolation wall (50) includes a plurality of holes (52) through which encapsulation material may flow during a process of making the semiconductor device (10). Several types of isolation wall (50) are presented.