FLIP-CHIP BONDING A DIE, IN PARTICULAR SEQUENTIAL BONDING A PLURALITY OF DIE, TO A CIRCUIT BOARD OR A LEAD FRAME WITH FORMATION OF A HIGH MELTING ALLOY AND CORRESPONDING DEVICE

摘要

A method of flip-chip bonding a plurality of die (10) having at least one metal layer (12) on a die surface to a board (16) comprises placing a first die (10) onto a board (16, 40) comprising one of a ceramic or substrate board or metal lead frame having a solderable surface and placing the first die (10) and the board (16, 40) into a reflow oven. The method includes reflowing at a first reflow temperature for a first period until the first metal board layer (18) and at least one of metal die layers (12) of the first die form an alloy (26) to adhere the first die (10) to the board (16, 40). The newly formed alloy (26) has a higher melting temperature than the first reflow temperature. Accordingly, additional die may be reflowed and flip-chip attached to the board (16, 40) without causing the bonding of the first die (10) to the board (16) to fail if the same reflow temperature is used and without any metals or alloys connecting (bridging) bond pads of a die (10) or of adjacent die (10).