Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication

摘要

A method for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process is provided. The method includes providing the semiconductor wafer into a cleaning module. The method further includes cleaning the semiconductor wafer by rotating a cleaning brush assembly. The method also includes applying an agitated cleaning liquid to clean the cleaning brush assembly.

主权项

1. A method for processing a semiconductor wafer, comprising:
providing the semiconductor wafer into a Chemical Mechanical Polishing (CMP) module; polishing the semiconductor wafer; removing the semiconductor wafer from the CMP module; cleaning the semiconductor wafer by a brush member surrounding a rotation shaft; supplying a cleaning liquid to an agitation transducer and agitating the cleaning liquid to an agitated cleaning liquid by the agitation transducer, wherein the agitation transducer circumferentially surrounds a segment of the rotation shaft which is not covered by the brush member; supplying the agitated cleaning liquid along a predetermined path, wherein at least a section of the predetermined path is parallel to a rotation axis about which the rotation shaft rotates; and cleaning the brush member by using the agitated cleaning liquid.