| 发明名称 | Light-emitting semiconductor component | ||
| 摘要 | An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound. | ||
| 申请公布号 | US9614134(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201414783255 | 申请日期 | 2014.04.09 |
| 申请人 | OSRAM Opto Semiconductors GmbH | 发明人 | Gebuhr Tobias;Ziereis Christian;Zitzlsperger Michael |
| 分类号 | H01L33/56;H01L25/00;H01L25/075;H01L33/08;H01L33/48;H01L33/54;H01L33/62 | 主分类号 | H01L33/56 |
| 代理机构 | DLA Piper LLP (US) | 代理人 | DLA Piper LLP (US) |
| 主权项 | 1. An optoelectronic component comprising: a carrier comprising a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component and configured as an elongated rod and placed on the mounting surface of the carrier, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, the housing at least partially encloses the carrier, a transmissive encapsulation compound fills the emitter cavity and encapsulates the light-emitting element, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound. | ||
| 地址 | DE | ||