发明名称 Substrate having annealed aluminum nitride layer formed thereon and method for manufacturing the same
摘要 A substrate having an annealed AlN layer includes a substrate made of a material selected from among a group including sapphire, silicon carbide (SiC), and aluminum nitride (AlN), and an aluminum nitride (AlN) layer formed on the substrate and having a thickness of 100 nm or greater. The aluminum nitride layer is annealed at a prescribed annealing temperature and in a nitrogen/carbon monoxide (N2/CO) mixed gas atmosphere, and the nitrogen/carbon monoxide (N2/CO) mixed gas has a mixture ratio of N2 gas/CO gas in a range of 0.95/0.05 to 0.4/0.6.
申请公布号 US9614124(B2) 申请公布日期 2017.04.04
申请号 US201514634713 申请日期 2015.02.27
申请人 TOHOKU UNIVERSITY;MIE UNIVERSITY 发明人 Fukuyama Hiroyuki;Miyake Hideto
分类号 H01L31/0256;H01L33/12;H01L33/00;H01L33/32;H01S5/323 主分类号 H01L31/0256
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A multi-layered substrate comprising: a base substrate made of a material selected from the group consisting of sapphire, silicon carbide (SiC), and aluminum nitride (AlN); and an annealed aluminum nitride layer formed on the base substrate and having a thickness of at least 100 nm, wherein the annealed aluminum nitride layer is formed by forming an aluminum nitride layer on the base substrate at a forming temperature; and annealing the aluminum nitride layer at an annealing temperature that is above the forming temperature and in a mixed gas atmosphere comprising nitrogen gas (N2) and carbon monoxide gas (CO), and wherein the mixed gas atmosphere has a mixture ratio of N2 gas/CO gas that ranges from 0.95/0.05 to 0.4/0.6.
地址 Sendai, Miyagi JP