| 主权项 |
1. A device for temporary bonding of a first substrate with a second substrate comprising:
a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface of the mounting apparatus, the mounting apparatus comprising:
a) an outer ring section for controllable fixing of the first substrate, andb) an inner ring section positioned inside of an inner edge of the outer edge section, the inner ring section having a recessed surface which is recessed from the mounting surface, said inner ring section further having at least one support surface for supporting the first substrate, the support surface being part of the mounting surface, deformation means for controllable deformation of the first substrate, the deformation means being configured to operate in the inner ring section, and bonding means for bonding of the first substrate to the second substrate by removal of the deformed first substrate from the mounting apparatus, wherein the mounting contour and/or the mounting surface and/or the mounting apparatus is/are made to be symmetrical, about a center Z of the mounting apparatus, and wherein, in the inner ring section, there are individually triggerable fixing elements for fixing of corresponding fixing sections along the first substrate. |
