发明名称 |
Method of manufacturing silicon carbide semiconductor device |
摘要 |
A method of manufacturing a silicon carbide semiconductor device includes the following steps. A silicon carbide substrate is prepared. A first mask layer is formed in contact with a first main surface of the silicon carbide substrate. The first mask layer includes a first layer disposed in contact with the first main surface, an etching stop layer disposed in contact with the first layer and made of a material different from that for the first layer, and a second layer disposed in contact with a surface of the etching stop layer opposite to the surface in contact with the first layer. A recess is formed in the first mask layer by etching the second layer and the etching stop layer. A first impurity region is formed in the silicon carbide substrate using the first mask layer with the recess. The first mask layer does not include a metallic element. |
申请公布号 |
US9613809(B2) |
申请公布日期 |
2017.04.04 |
申请号 |
US201414766963 |
申请日期 |
2014.01.17 |
申请人 |
Sumitomo Electric Industries, Ltd. |
发明人 |
Horii Taku;Kijima Masaki |
分类号 |
H01L21/04;H01L29/66;H01L29/16;H01L29/78;H01L21/02;H01L21/311;H01L21/324;H01L29/06;H01L21/033 |
主分类号 |
H01L21/04 |
代理机构 |
Venable LLP |
代理人 |
Venable LLP ;Sartori Michael A.;Remus Laura G. |
主权项 |
1. A method of manufacturing a silicon carbide semiconductor device, comprising steps of:
preparing a silicon carbide substrate having a first main surface and a second main surface opposite to each other; forming a first mask layer in contact with said first main surface of said silicon carbide substrate, said first mask layer including a first layer disposed in contact with said first main surface, an etching stop layer disposed in contact with said first layer and made of a material different from that for said first layer, and a second layer disposed in contact with a surface of said etching stop layer opposite to the surface in contact with said first layer; forming a recess in said first mask layer by etching said second layer and said etching stop layer; and forming a first impurity region having a first conductivity type in said silicon carbide substrate using said first mask layer with said recess, said first mask layer not including a metallic element, and further comprising a step of forming a second mask layer on said second main surface of said silicon carbide substrate, said second mask layer not including a metallic element. |
地址 |
Osaka-shi JP |