Carrier array and light emitting diode package

摘要

A carrier array adapted for carrying a plurality of chips is provided. The carrier array includes a lead frame, controllers and first packages. The lead frame includes a frame body and a plurality of lead frame units. The lead frame units are connected with each other through the frame body and arranged in an array. Each of the lead frame units includes at least one first pin connected with the frame body and a plurality of second pins not connected with the frame body. The controllers are disposed on the lead frame units, and electrically connected with the corresponding lead frame units, respectively. Each of the first packages is disposed on the lead frame, and respectively has an opening to expose a portion region of the corresponding lead frame unit, and the openings are adapted for accommodating the chips. A light emitting diode package is also provided.

主权项

1. A carrier array for carrying a plurality of chips, the carrier array comprising:
a lead frame comprising a frame body and a plurality of lead frame units, wherein the plurality of lead frame units is connected with each other through the frame body and arranged in an array, each of the plurality of lead frame units comprises at least one first pin connected with the frame body and a plurality of second pins separated from each other, and the plurality of second pins is not connected with the frame body; at least one controller disposed on each of the plurality of lead frame units, wherein the at least one controller is electrically connected with one of the plurality of lead frame units correspondingly, and the at least one controller is electrically connected with one of the plurality of chips in series correspondingly through one of the plurality of second pins; and a plurality of first packages disposed on the lead frame, wherein each of the plurality of first packages corresponds to and encapsulates one of the plurality of lead frame units and the at least one controller disposed thereon, each of the plurality of first packages has an opening to expose a portion region of the corresponding lead frame unit, and the opening is adapted to accommodate at least one of the plurality of chips.