发明名称 Formaldehyde free electroless copper plating compositions and methods
摘要 The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
申请公布号 US9611550(B2) 申请公布日期 2017.04.04
申请号 US201313769332 申请日期 2013.02.17
申请人 Rohm and Haas Electronic Materials LLC 发明人 Chow Andy Lok-Fung;Yee Dennis Kwok-Wai;Li Crystal P. L.
分类号 H01B1/02;C23C18/40;C09D1/00;H05K3/18 主分类号 H01B1/02
代理机构 代理人 Piskorski John J.
主权项 1. An aqueous based composition consisting of one or more sources of copper ions, one or more chelating agents selected from the group consisting of polycarboxylic acids, salts thereof, polyaminocarboxylic acids and salts thereof, water, optionally one or more stabilizers selected from the group consisting of amines, alkanolamines, thioamides, azole compounds and salts thereof, optionally one or more surfactants, and one or more reducing agents having formula: wherein Xy+ is a neutralizing counter cation of formula (I), where y+ is an integer of one or greater and Xy+ is selected from the group consisting of H+, ammonium cation, quaternary ammonium cation, sulfonium cation, phosphonium cation, pyridinium cation, monovalent metal cation, multivalent metal cation and divalent organometallic cation; R and R′ are independently hydrogen, carboxyl, carboxyalkyl, sulfonate, sulfoxide, unsubstituted, linear or branched alkyl, sulfinate; substituted or unsubstituted aryl;Z is chosen from unsubstituted, linear or branched (C1-C6) alkyl, acetyl or substituted or unsubstituted (C6-C10) aryl; m is an integer of 1 to 6; and n is 1; and the composition is free of formaldehyde.
地址 Marlborough MA US