| 发明名称 | Multilayer electronic support structure with integral constructional elements | ||
| 摘要 | A multilayer electronic support structure including at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a dielectric material that is sandwiched between the two adjacent feature layers and at least one constructional element through the dielectric material spanning between said pair of adjacent feature layers in a Z direction perpendicular to the X-Y plane; wherein said at least one constructional element is characterized by having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane and wherein the at least one constructional element is fully encapsulated within the dielectric material and is electrically isolated from its surrounding. | ||
| 申请公布号 | US9615447(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201213555437 | 申请日期 | 2012.07.23 |
| 申请人 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | 发明人 | Hurwitz Dror;Huang Alex |
| 分类号 | H05K1/02;H01L23/498;H01L23/00;H05K1/11 | 主分类号 | H05K1/02 |
| 代理机构 | Wiggin and Dana LLP | 代理人 | Wiggin and Dana LLP ;Rosenblatt Gregory S.;Hall Jonathan D. |
| 主权项 | 1. A multilayer electronic support structure, comprising: at least one pair of adjacent circuit layers comprising circuit elements extending in an X-Y plane that are embedded in dielectric material and that are separated by a via layer; said adjacent circuit layers and said via layer comprising metallic vias that are embedded in said dielectric material comprising glass fibers in a polymer matrix, said adjacent circuit layers comprising metallic features and said via layer that is sandwiched between the two adjacent circuit layers comprising metallic vias that electrically couple said adjacent circuit layers; and at least one non-electronically functional metallic constructional element disposed within the dielectric material and spanning at least the via layer in a Z direction perpendicular to the X-Y plane; wherein said at least one non-electronically functional metallic constructional element comprises a metallic via post having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane; and wherein the at least one non-electronically functional metallic constructional element is fully encapsulated within the dielectric material and is electrically isolated from its surrounding. | ||
| 地址 | Zhuhai CN | ||