Integrated circuit chip cooling device

摘要

An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.

主权项

1. A device for cooling an integrated circuit chip, comprising:
a network of micropipes including pipe portions; wherein said pipe portions are connected by valves, each valve comprising at least one bilayer strip, wherein said at least one bilayer strip is configured to pass from a first shape where the at least one bilayer strip delimits in the valve a first opening when valve temperature is lower than a first threshold to a second shape where the at least one bilayer strip delimits in the valve a second opening larger than the first opening when valve temperature reaches the first threshold; and wherein said micropipe network comprises:
a first network of interconnected trenches located in a first substrate, anda second network of interconnected trenches located in a second substrate stacked to the first substrate and separated from the first substrate by a stack of two layers of different materials having different thermal expansion coefficients.