发明名称 Thermal interface material with mixed aspect ratio particle dispersions
摘要 An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
申请公布号 US9611414(B2) 申请公布日期 2017.04.04
申请号 US201414328834 申请日期 2014.07.11
申请人 HENKEL IP & HOLDING GMBH 发明人 Timmerman John;Misra Sanjay
分类号 C09K5/14;H05K7/20;H01L23/34;C08K7/04;C08K3/38;C08K3/22;C08K3/04;C08K7/18 主分类号 C09K5/14
代理机构 代理人 Cummings James E.
主权项 1. A thermal interface material positionable in proximity to a heat source for thermal dissipation from the heat source and for shielding of electromagnetic interference, said thermal interface material comprising: a polymer matrix; and thermally conductive particulate filler dispersed in said polymer matrix at 40-50% by volume, said particulate filler including substantially spherical alumina particles having an aspect ratio of between 0.8-1.2 and a spherical particle diameter, and platelet particles having a length, a width, and a thickness and a platelet particle diameter, wherein said length and said width are each greater than said thickness, said platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said platelet particles to said spherical alumina particles being between 0.1:1 and 0.2:1, and a particle diameter ratio of said platelet particle diameter to said spherical particle diameter being between 1:1 and 20:1, said platelet particles consist of boron nitride, wherein said thermal interface material exhibits a thermal conductivity of at least 0.5 W/m*K, and a compressive modulus of less than 5 MPa at 20° C.
地址 Duesseldorf DE