Method for fabricating semiconductor package and semiconductor package using the same

摘要

Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process. In one embodiment, the method for fabricating a semiconductor package includes forming a frame on a carrier, forming a first pattern layer on the frame, first encapsulating the frame and the first pattern layer using a first encapsulant, forming conductive vias electrically connected to the first pattern layer while passing through the first encapsulant, forming a second pattern layer electrically connected to the conductive vias on the first encapsulant, forming a first solder mask formed on the first encapsulant and exposing a portion of the second pattern layer to the outside, removing the frame by an etching process and etching a portion of the first pattern layer, and attaching a semiconductor die to the first pattern layer.

主权项

1. A method for fabricating a semiconductor package, the method comprising:
forming a first leadframe pattern; encapsulating the first leadframe pattern with an encapsulant defining:
an encapsulant first surface adjacent the first leadframe pattern; andan encapsulant second surface opposite the encapsulant first surface; forming a conductive via extending from the encapsulant second surface to the first leadframe pattern; forming a second leadframe pattern on the encapsulant second surface, the second leadframe pattern coupled to the first leadframe pattern through the conductive via; etching part of the first leadframe pattern to form an etched first leadframe surface configured to receive an interconnect to a semiconductor die; and one or both of:
forming a first solder mask on the encapsulant second surface and exposing a portion of the second leadframe pattern; and/orforming a second solder mask on the encapsulant first surface and exposing a portion of the etched first leadframe surface.