| 发明名称 | Method of production of multilayer circuit board | ||
| 摘要 | A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C). | ||
| 申请公布号 | US9615465(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201113876495 | 申请日期 | 2011.09.30 |
| 申请人 | ZEON CORPORATION | 发明人 | Tateishi Yohei;Iga Takashi |
| 分类号 | B29C65/00;H05K3/46;H05K1/03;H05K1/02 | 主分类号 | B29C65/00 |
| 代理机构 | Birch, Stewart, Kolasch & Birch, LLP | 代理人 | Birch, Stewart, Kolasch & Birch, LLP |
| 主权项 | 1. A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with a surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C), wherein: the curing agent (I) is at least one type of agent selected from the group consisting of a polyvalent epoxy compound, a dicarboxylic acid derivative, and a polyol compound, and the curing agent (II) is at least one type of agent selected from the group consisting of a polysulfide, polymercaptan, polyamide, chain aliphatic polyamine, cyclic aliphatic polyamine, and complexes of said amines. | ||
| 地址 | Tokyo JP | ||