| 发明名称 | Wafer handler and methods of manufacture | ||
| 摘要 | A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler. | ||
| 申请公布号 | US9613842(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201414183989 | 申请日期 | 2014.02.19 |
| 申请人 | GLOBALFOUNDRIES INC. | 发明人 | Garant John J.;Griffith Jonathan H.;Hedrick Brittany L.;Sprogis Edmund J. |
| 分类号 | H01L21/00;B32B37/00;B32B38/00;H01L21/683;B32B37/24;B32B38/10 | 主分类号 | H01L21/00 |
| 代理机构 | Roberts Mlotkowski Safran Cole & Calderon, P.C. | 代理人 | Cai Yuanmin;Calderon Andrew M.;Roberts Mlotkowski Safran Cole & Calderon, P.C. |
| 主权项 | 1. A structure comprising: a wafer handler having an inherent bow; a removable stress compensating layer on a backside surface of the wafer handler; a first stress layer on a front side surface of the wafer handler; and a second stress layer on the first stress layer, wherein the removable stress compensating layer on the backside surface of the wafer handler compensates for a stress component placed on the wafer handler by the first stress layer. | ||
| 地址 | Grand Cayman KY | ||