| 发明名称 | Semiconductor device and method for manufacturing semiconductor device | ||
| 摘要 | A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed. | ||
| 申请公布号 | US9613927(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201514750897 | 申请日期 | 2015.06.25 |
| 申请人 | Rohm Co., Ltd. | 发明人 | Kimura Akihiro;Sunaga Takeshi;Yasunaga Shouji;Koga Akihiro |
| 分类号 | H01L23/00;H01L23/31;H01L23/433;H01L23/495;H01L21/56;H01L21/48;H01L23/36;H01L23/367;H01L25/065;H01L25/00 | 主分类号 | H01L23/00 |
| 代理机构 | Howison & Arnott, LLP | 代理人 | Howison & Arnott, LLP |
| 主权项 | 1. A method for manufacturing a semiconductor device comprising the steps of: preparing a lead frame including a plurality of die pads each having a bottom surface, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips in a manner such that a recess having a recess bottom surface and a recess side surface is formed in the sealing resin, and that the bottom surfaces of the respective die pads are exposed from the recess bottom surface; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via an adhesive layer after the sealing resin is formed, the attaching being performed in a manner such that the heat dissipation plate is brought into the recess but spaced apart from both the recess bottom surface and the recess side surface. | ||
| 地址 | Kyoto JP | ||