发明名称 Immersion de-taping
摘要 Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.
申请公布号 US9613845(B2) 申请公布日期 2017.04.04
申请号 US201414158503 申请日期 2014.01.17
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Liu Ching Tasi;Chang Fu-Chen;Li Chien-Chen;Liu Te Lung;Lu Kuo Liang
分类号 B29C65/50;B32B37/12;B32B38/10;B32B39/00;H01L21/683 主分类号 B29C65/50
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A method comprising: providing a substrate having a substrate tape attached thereto, the substrate comprising electrically conductive connectors attached to the substrate tape; providing a fluid between the substrate and the substrate tape; and while the fluid is between the substrate and the substrate tape, removing the substrate tape from the substrate, wherein the substrate is inclined during the removing the substrate tape from the substrate.
地址 Hsin-Chu TW