发明名称 Exposure dose homogenization through rotation, translation, and variable processing conditions
摘要 A substrate may be disposed on a substrate support in a flood exposure treatment system. A flood exposure dose profile may be selected. The substrate may be exposed to flood irradiation from a source, and the flood irradiation may be terminated when the selected flood exposure dose profile is achieved. Exposing the substrate to flood irradiation may comprise controlling at least one of a substrate rotation rate, a source scanning rate, a substrate scanning rate, a source power setting, a distance from the source to the substrate, a source aperture setting, an angle of incidence of flood irradiation on the substrate, and a source focus position to achieve the selected flood exposure dose profile.
申请公布号 US9612534(B2) 申请公布日期 2017.04.04
申请号 US201514801703 申请日期 2015.07.16
申请人 TOKYO ELECTRON LIMITED 发明人 Schattenburg Mark L.;Hendel Rudolf H.;Carcasi Michael
分类号 G03F7/20;C07K14/47 主分类号 G03F7/20
代理机构 DLA Piper LLP US 代理人 DLA Piper LLP US
主权项 1. A method of treating a substrate, comprising: disposing the substrate on a substrate support in a flood exposure treatment system; selecting a flood exposure dose profile; and exposing the substrate to flood irradiation from a source, terminating the flood irradiation when the selected flood exposure dose profile is achieved, wherein exposing the substrate to flood irradiation comprises controlling at least one of a substrate rotation rate, a source scanning rate, a substrate scanning rate, a source power setting, a distance from the source to the substrate, a source aperture setting, an angle of incidence of flood irradiation on the substrate, and a source focus position to achieve the selected flood exposure dose profile.
地址 Tokyo JP