Structure to prevent solder extrusion

摘要

A spacer structure formed adjacent a solder connection which prevents solder extrusion and methods of manufacture are disclosed. The method includes forming a solder preform connection on a bond pad of a chip. The method further includes forming a spacer structure on sidewalls of the solder preform connection. The method further includes subjecting the solder preform connection to a predetermined temperature to form a solder connection with the spacer structure remaining thereabout.

主权项

1. A method comprising:
forming a solder preform connection on a bond pad of a chip; forming a spacer structure on sidewalls and an upper surface of the solder preform connection; removing the spacer structure from a top surface and upper portions of the sidewalls of the solder preform connection while leaving a portion of the spacer structure in contact with an underlying passivation layer; subjecting the solder preform connection to a predetermined temperature to form a solder bump, with the spacer structure remaining thereabout; and forming a packaged assembly by bonding the solder bump to a laminate and injecting underfill about the solder bump which forms a void adjacent to the spacer structure, wherein the spacer structure is structured and located to prevent extrusion of the solder bump within the void formed in the underfill, and the spacer structure is formed about a perimeter of the solder bump on a portion of the passivation layer underlying the solder bump, a ball metallization structure formed within a via of the passivation layer and in contact with the bond pad, and the solder bump.